IEEE Technology and Engineering Management Society Conference: Asia-Pacific


Bengaluru, India 15 & 16 December 2023

The IEEE Technology and Engineering Management Society Conference – Asia Pacific 2023 (TEMSCON-ASPAC-2023) is a conference focused on the challenges and practices of technology and innovation management in today’s business environments. Recently, emerging markets have become a main attraction for their rapid economic development. Dynamic growth of new ventures and start-ups in these markets has brought new business competitive landscape. Existing organizations have taken a new level of importance in driving innovation. Nevertheless, a success of managing innovation with differences in environment and organization context requires careful adaptions. As such, there is a strong urge to disclose both new theories and new patterns in management practice so that innovation management in emerging markets context can be further advanced. We invite contributions from scholars, practitioners, researchers, innovators, and entrepreneurs to help advance the understanding and the state of practice related to successful technology and engineering management. Contributions may take the form of academic research or practice-focused papers. The event includes an Industry Forum where industry leaders speak on the directions and challenges they see in industry, its use of technology and how to manage it.

Paper Presentation - Session Details

Technical Co-Sponsors

Call For Papers

Dear Researcher,

On behalf of IEEE TEMSCON 2023 organising committee, we invite you to professionally enriching flagship technical conference of ASIA-PACIFIC region, TEMSCON ASPAC 2023 to be organised on December 15th to 16th 2023. The event will cover multiple technical tracks covering multiple domains. Eminent international speakers from various countries will deliver talks and conduct various workshops and tutorials. The conference will provide a platform for the exchange of opinions among the researchers and with the experts as the prospective researcher will present their own work in form of oral presentation, apart from taking advantage of talks from number of international experts.

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Sponsors / Partners

Major Topic areas include:
AI and Global Disruption
Balancing the Norms for a Tech powered Society, Government and Regulators
Carbon Neutral, Green, Climate and Sustainable Technologies
Cybersecurity Policies and Processes
Digital Health care systems
Diversity, Equity and Inclusion in Energy Management
Eco Friendly Manufacturing
Engineering Learning and Skills Development
Fintech - Banking, Finance & Insurance
Innovation and Organization Practices
Innovative Business Models for Startups
IoT, Robotics and Automation
Learning Analytics and people management
People and Leadership Practices for new world
Software Engineering in the new era
Sustainable Transportation
Technologies for Recycling, Reuse and Refurbishment
Technologies in Industry 4.0, 5.0

Important Dates

Events Dates
Early bird Submission Deadline:
15th September, 2023
Regular submission Deadline:

30th October, 2023
(Hard deadline)

Notification of Acceptance:
15th November, 2023
Registration Deadline:
30th November, 2023
Camera Ready Submission Deadline:
5th December, 2023

Guidelines for Author

We invite engineering leaders, researchers, educators, innovators, entrepreneurs, and students to submit their original manuscripts TEMSCON-ASPAC 2023. Contributions may take the form of academic research or practice-focused papers, to help advance the understanding and the state of practice related to successful technology and engineering management.

Acceptance of papers for presentation at TEMSCON-ASPAC 2023 will be based on a descriptive paper review. Accepted and presented papers will be published in the conference proceedings and submitted to IEEE Xplore®.

The author must follow the following guidelines for the paper acceptance.

Paper submission guidelines

  • All papers are required to be in English language.
  • Papers submitted to ASPAC TEMSCON 2023 shall contain original work by the author(s) that have not been published or submitted for publication. The IEEE anti-plagiarism policy is applicable to all submissions.
  • The authors are required to use IEEE Standard manuscript template for the conference. The manuscript template can be downloaded from IEEE conference template page. click here
  • Authors are required to prepare and submit the papers in IEEE standard A4 size two-column conference format. The paper must be a maximum of 8 pages in length including diagrams, pictures and references.
  • Choose one topic related to the paper. This information will be used by committee for assigning appropriate reviewers.
  • The introduction of paper shall clearly indicate the unique aspect of submission
  • The papers must be uploaded in PDF format.
  • Changes can be made even after submission till the deadline. No submissions will be accepted after the submission deadline.

Review and acceptance

  • All papers will be peer reviewed.
  • English shall be official language.
  • Paper must not exceed 8 pages. Failing to do so may result in rejection.
  • Acceptance is based on condition that at least one author will register and present the paper at conference. IEEE reserves rights to exclude a paper from distribution after the conference if the paper is not presented at the conference.

Presentation guidelines

  • The presentation should be in English.
  • Presentations should be made in ASPAC TEMSCON 2023 template.
  • Presentation discussion should be in English.
  • Presentation should not exceed 10 to 12 minutes.
  • 3 to 5 minutes will be given for Q&A.

Important note to authors

  • In case of multiple authors for an accepted paper, at least one author is expected to attend the meeting.
  • Registration fee must be paid within the due deadline. Late payment may result in the paper not being included in the conference program and any other publications that are produced for distribution at conference.
  • Each paid fee covers one presentation and an additional registration fee applies for any extra presentation.
  • Participation will be confirmed upon receipt of the online registration form and fee payment.
  • Per ASPAC TEMSCON no show policy, the program chair reserves the right to exclude any unpresented papers from proceeding to IEEE Xplore©.


Author Category Early Bird (Indian) Early Bird (Foreign) Regular (Indian) Regular (Foreign)
7,000 INR
250 USD
8,000 INR
350 USD
IEEE Member
9,000 INR
350 USD
9,500 INR
400 USD
Non-IEEE Member
10,000 INR
450 USD
12,000 INR
500 USD
Delegates / Participants Fees
IEEE Member
2,000 INR / Day
1,500 INR / Day
Non-IEEE Member
2,500 INR / Day
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